HOME Products Intelligent Systems NVIDIA Edge AI eNVP Series | Embedded Edge AI & NVR Systems eNVP-JNX-AI-UB000
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  • JNXUB0001
  • 14f078de8d4114fe1eb56002a2813cdd
  • 72f6e9b6f41df343e3fd6ef3ab74a531
  • JNXUB0001
  • 14f078de8d4114fe1eb56002a2813cdd
  • 72f6e9b6f41df343e3fd6ef3ab74a531
JNXUB0001 14f078de8d4114fe1eb56002a2813cdd 72f6e9b6f41df343e3fd6ef3ab74a531

eNVP Series | Embedded Edge AI & NVR Systems

eNVP-JNX-AI-UB000

Ultra Compact Rugged Embedded Edge AI System with NVIDIA® Jetson Xavier™ NX

• Fanless AI edge embedded box PC
• 6-core NVIDIA Carmel Arm® v8.2 64-bit CPU
• 384-core NVIDIA Volta™ GPU with 48 Tensor Cores
• Onboard 8 GB 128-bit LPDDR4 memory (59.7 GB/s)
• Supports 2 x GbE
• Supports 1 x M.2 M-key 2280 (for NVMe SSD)
• Supports 1 x M.2 B-key 3052/3042 (for 5G/4G)
• Supports 1 x M.2 E-key 2030 (for Wi-Fi/BT module)
• Supports 1 x CAN bus
• Supports 3 x USB 3.0, 1 x USB 2.0
• Supports 1 x Micro USB (for Flash OS)
• Supports 1 x UART, 1 x RS-485, 2 x I2C, 2 x SPI, 6 x GPIO, 2 x +5V Output, 2 x +3.3 V Output
• 12 VDC input
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Specification

System
AI Accelerator
NVIDIA® Jetson Xavier™ NX
CPU
6-core NVIDIA Carmel Arm® v8.2 64-bit CPU
GPU
384-core NVIDIA Volta™ GPU with 48 Tensor Cores
Memory
Onboard 8 GB 128-bit LPDDR4 (59.7 GB/s)
Interface
CAN Bus
1 x CAN bus
Indicators
1 x LED (PWR)
USB
3 x USB 3.0, 1 x USB 2.0
OTG USB
1 x Micro USB (for Flash OS)
DIO
--
Display
1 x HDMI, 1 x DisplayPort
Audio
1 x Audio In/Out
Button
1 x Recovery, 1 x Reset
Power
1 x PWR Input (3-pin terminal block)
COM
--
Others
2 x UART, 1 x RS-485, 2 x I2C, 2 x SPI, 6 x GPIO, 2 x +5V Output, 2 x +3.3V Output
Storage
Storage
16 GB eMMC 5.1
SATA
--
SD Card
1 x microSD
NVMe SSD
Supported (via Expansion)
Power
Power Supply
12 VDC
Network
Ethernet
2 x GbE
PoE
--
Antenna
5 x ANT.
Wi-Fi/BT
Supported (via Expansion)
4G/5G
Supported (via Expansion)
GPS
--
Expansion
M.2
1 x M.2 M-key 2280, 1 x M.2 E-key 2230, 1 x M.2 B-key 3042/3052
General
Dimensions
114 x 102 x 60.7 mm (4.48” x 4.01” x 2.39”) (with bracket)
Weight
0.65 kg
Operating Temperature
(Please refer to the datasheet)
Storage Temperature
40 ~ 85 °C (-40 ~ 185 °F)
Storage Humidity
10% ~ 90%, non-condensing
Vibration
MIL-STD-810G, Method 514.7, Category 4 MIL-STD-810G, Method 516.7, Procedure I (Shock)
Certification
CE, FCC Class A (according to EN 55032/55035)

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