AI Accelerator Compatible Computers

IVS-5830

Fanless In-Vehicle Computer with 13th Gen Intel® Core™ i3/i5/i7 Processor

• 13th Gen Intel® Core™ i3/i5/i7
• 1 x DDR5 SODIMM
• 9 ~ 55 VDC with Ignition
• TPM 2.0
• Support isolated CAN, DI, DO, RS485
• Optional 4G LTE, 5G, Wi-Fi
• Fanless design

Specification

System
CPU
13th Gen Intel® Core™ i7-1365UE, i5-1335UE, i3-1315UE
Memory
2 x DDR5 SODIMM up to 64 GB
Storage
2 x Front-access 2.5” SSD Bay
Real Time Clock
Yes
Security
TPM 2.0
Thermal Design
Fanless design
Operating System
Linux Kernel 5.15 LTS & above (64-bit), Windows 10,11 (64-bit)
Power Requirement
Input Voltage
9 ~ 55 VDC
Power Consumption
120 W (typical)
Power Connector
5 pin terminal block
Environmental and Mechanical
Dimension
318 x 194 x 91 mm (12.52” x 7.63” x 3.58”)
Weight
4.6 kg
Operating Temperature
-20 ~ 60 °C (-4 ~ 140 °F)
Storage Temperature
-40 ~ 80 °C (-40 ~ 176 °F)
Operating Humidity
5% ~ 95% relative humidity (RH), non-condensing
Certification
Regulations
CE, FCC, RoHs
Interface
Serial Port
2 x RS232/RS422/485 DB9, 2 x Isolated RS485
CAN Bus
2 x Isolated CAN Bus
Ethernet
1 x RJ45 Intel® I226IT 2.5GbE LAN, 2 x RJ45 Intel® I210IT GbE LAN
USB
4 x USB 3.2 Gen1 x1 (Type A), 2 x USB 2.0 (Type A), 1 x USB 3.2 Gen1 x1 (Type C)
DI/DO
4 x DI, 4 x DO Isolated terminal block
Display
1 x VGA, 1 x HDMI, 1 x DP, 2 x DP with MXM (Optional)
Indicator
1 x Power LED, 1 x HDD LED, 1 x Status LED
Expansion Slot
1 x M.2 M-Key 2280, PCIe Gen4 x4 for NVMe SSD, 2 x M.2 B-Key 3042/3052, PCIe x1 + USB 3.2/2.0, 1 x M.2 E-Key 2230 PCIe x1 + USB 2.0, 1 x MXM slot
SIM Slot
2 x SIM Card Holder
Antenna
6 x External Antenna holes

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